Title:
POLYAMIDE RESIN, POLYAMIDE RESIN COMPOSITION AND MOLDED FORM
Document Type and Number:
Japanese Patent JP3464759
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a polyamide resin and a polyamide resin composition, excellent in mechanical properties, heat resistance, moldability and dimensional stability, low in rigidity drop in a highly humid atmosphere, and suitable for molded products such as automotive harness connectors with excellent chemical resistance and automotive engine cooling water-related parts.
SOLUTION: The polyamide resin (composition) for automotive connectors and the polyamide resin composition for glass fiber-reinforced automotive engine cooling water-related parts, each of which has specific thermal properties and viscoelastic properties, is low in rigidity drop under high-humidity conditions and excellent in chemical resistance, are each composed of (a) 60-25 mol.% of hexamethylene terephthalamide unit, (b) 60-15 mol.% of hexamethylene hexahydroterephthalamide, (c) 0-60 mol.% of at least one kind of an aliphatic polyamide unit selected from undecanamide unit, dodecanamide unit and caproamide unit, and (d) 0-60 mol.% of polyamide unit as an aliphatic polyamide unit derived from an equimolar salt of an aliphatic dicarboxylic acid and an aliphatic diamine, with the number of carbon atoms per amido group (amido group concentration) being ≥8.
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Inventors:
Go Sakurai
Nobuo Naganawa
Kazuhiko Kobayashi
Nobuo Naganawa
Kazuhiko Kobayashi
Application Number:
JP14640998A
Publication Date:
November 10, 2003
Filing Date:
May 27, 1998
Export Citation:
Assignee:
Toray Industries, Inc.
Yazaki Corporation
Yazaki Corporation
International Classes:
B60R16/02; B29C45/00; C08G69/02; C08J5/10; C08K3/00; C08K7/14; C08L77/00; C08L77/10; H01R13/46; B29K77/00; B29L31/18; B29L31/36; (IPC1-7): C08G69/02; B60R16/02; C08K7/14; C08L77/00
Domestic Patent References:
| JP7207151A | ||||
| JP4937575B1 |
Attorney, Agent or Firm:
Shinichi Ogawa (2 outside)