Title:
POLYAMIDEIMIDE RESIN INSULATION COATING MATERIAL AND INSULATION WIRE USING THE SAME
Document Type and Number:
Japanese Patent JP2012251155
Kind Code:
A
Abstract:
To provide an insulation wire using a polyamideimide resin insulation coating material giving an insulating film having preferable flexibility and excellent in press molding resistance.
This polyamideimide resin insulation coating material for forming a polyamideimide film on a conductor is obtained by synthesis reaction of an isocyanate component and an acid component in a solvent, where the isocyanate component comprises 2,4'-diphenylmethanediisocyanate as the isocyanate having flexing structure in a molecule, the content of the 2,4'-diphenylmethanediisocyanate is in the range of 5-50 mol%, and the elongation of the polyamideimide film is 71% or more.
Inventors:
KIKUCHI HIDEYUKI
HINO DAISUKE
TAKANO YUJI
FUNAYAMA YASUHIRO
HINO DAISUKE
TAKANO YUJI
FUNAYAMA YASUHIRO
Application Number:
JP2012167882A
Publication Date:
December 20, 2012
Filing Date:
July 30, 2012
Export Citation:
Assignee:
HITACHI MAGNET WIRE CORP
International Classes:
C09D179/08; C09D5/25; H01B3/30; H01B7/02
Domestic Patent References:
| JP2008285660A | 2008-11-27 | |||
| JP2009161683A | 2009-07-23 | |||
| JPH06145281A | 1994-05-24 | |||
| JPH107984A | 1998-01-13 | |||
| JP2004512401A | 2004-04-22 | |||
| JP2001172360A | 2001-06-26 |
Attorney, Agent or Firm:
Hiroshi Okikawa