Title:
ポリイミドフィルムおよびその製造方法
Document Type and Number:
Japanese Patent JP7382505
Kind Code:
B2
Abstract:
Disclosed are a polyimide film and a method for manufacturing same, the polyimide film being derived by imidizing polyamic acid having a weight-average molecular weight of about 250,000 g/mol to about 440,000 g/mol, or being derived by imidizing a polyamic acid solution having polyamic acid solid content of about 14 wt% to about 20 wt%, wherein the polyimide film has a modulus of about 2 GPa to about 5 GPa.
Inventors:
Kim, Dong Young
Park, Se Joo
Won, Dong Young
Park, Se Joo
Won, Dong Young
Application Number:
JP2022530798A
Publication Date:
November 16, 2023
Filing Date:
October 19, 2020
Export Citation:
Assignee:
PI Advanced Materials Company Limited
International Classes:
C08J5/18; C08G73/10
Domestic Patent References:
| JP2003165850A | ||||
| JP2007162005A |
Foreign References:
| WO2019065624A1 | ||||
| WO2018030410A1 |
Attorney, Agent or Firm:
Hiroshi Sakanaka
Mitsuo Kuwata
Mitsuo Kuwata
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