Title:
線膨張係数を制御したポリイミドフィルム及び積層体
Document Type and Number:
Japanese Patent JP3994696
Kind Code:
B2
Abstract:
An aromatic polyimide film of polyimide composed of a 3,3',4,4'-biphenyltetracarboxylic acid component and a p-phenylenediamine component, which has a thickness of 35 to 55 mum and is employed for manufacturing a polyimide film/metal film laminate, preferably has a linear thermal expansion coefficient of 17x10-6 to 24x10-6 cm/cm/° C. (TD) in the temperature range of 50-200° C., and a modulus of tensile elasticity of 700 kgf/mm2 or more (TD), and has a surface having been subjected to discharge treatment.
Inventors:
Tomohiko Yamamoto
Takuji Takahashi
Narui Koji
Mitsui Hiroto
Tomohisa Komoda
Takuji Takahashi
Narui Koji
Mitsui Hiroto
Tomohisa Komoda
Application Number:
JP2001230272A
Publication Date:
October 24, 2007
Filing Date:
July 30, 2001
Export Citation:
Assignee:
Ube Industries,Ltd.
International Classes:
C08J7/00; B29C71/02; B32B15/08; B32B27/34; C08G73/10; C08J5/18; C09J179/08; B29K79/00
Domestic Patent References:
| JP2000244083A | ||||
| JP4006213B2 | ||||
| JP8120098A | ||||
| JP11209488A | ||||
| JP11005954A | ||||
| JP62236827A |