Title:
POLYIMIDE SOLUTION FOR PRINTED WIRING BOARD, METHOD FOR PRODUCTION OF PRINTED WIRING BOARD, AND PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2016169373
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polyimide (hereinafter called PI) solution capable of forming on the surface of a substrate, a porous PI coat having fine pores favorable in adhesiveness with the substrate, to provide a printed wiring board having the formed coat and a production method therefor, and further to provide the printed wiring board of low dielectric constant adaptable in high frequency region.SOLUTION: There is provided a PI solution for printed wiring board containing the good and poor solvents to PI which includes an oxyalkylene unit and/or siloxane unit in a main chain. The production method for the printed wiring board includes a process of forming a porous PI coat by drying the PI solution after coating on the surface of a substrate. The printed wiring board is produced by laminating the porous PI coat on the substrate surface to integrate, and has the following characteristics: (1) the main chain of PI includes the oxyalkylene unit and/or the siloxane unit; and (2) the average pore diameter of the porous PI coat is 10 nm or more but 2,000 nm or less.SELECTED DRAWING: None
Inventors:
YAMADA MUNENORI
SHIBATA KENTA
TAKEUCHI KO
YOSHINO FUMIKO
MATSUSHITA MUTSUMI
SHIGETA AKIRA
ECHIGO YOSHIAKI
SHIBATA KENTA
TAKEUCHI KO
YOSHINO FUMIKO
MATSUSHITA MUTSUMI
SHIGETA AKIRA
ECHIGO YOSHIAKI
Application Number:
JP2016043429A
Publication Date:
September 23, 2016
Filing Date:
March 07, 2016
Export Citation:
Assignee:
UNITIKA LTD
International Classes:
C08L79/08; B32B5/18; B32B15/088; B32B27/34; C08G73/10; C08J9/28; C09D7/12; C09D179/08; C09D183/10; H05K1/03
Domestic Patent References:
| JP2013216776A | 2013-10-24 | |||
| JP2005320495A | 2005-11-17 | |||
| JPH08333455A | 1996-12-17 | |||
| JPH04364795A | 1992-12-17 |
Foreign References:
| WO2011089922A1 | 2011-07-28 |