To provide a new polyorganosiloxane composition which excels in photosensitive characteristic under UV-i line and in adhesiveness to an organic thin film, can be cured at a low temperature of ≤250°C, ensures very small volumetric shrinkage during this heat curing, and excels in low degassing property in a resin structure or resin film after the heat curing.
The polyorganosiloxane composition contains (a) 100 parts by mass of a polyorganosiloxane obtained by mixing a specific silanol compound and a specific alkoxysilane compound and polymerizing the mixture in the presence of a catalyst without adding water, (b) 0.2-20 parts by mass of a photopolymerization initiator, and (c) 1-50 parts by mass of a polythiol compound containing at least two sulfanyl groups.
COPYRIGHT: (C)2008,JPO&INPIT
Kimura Masashi
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Norio Kagami
Jun Komatsu