Title:
POLYPHENYLENE OXIDE MOLDING MATERIAL
Document Type and Number:
Japanese Patent JPH03265652
Kind Code:
A
Abstract:
PURPOSE:To prepare the title material having excellent electrical properties in a high-frequency region and a high heat resistance by compounding a compsn. comprising a polyphenylene oxide, a crosslinker, and an initiator with an inorg. filler. CONSTITUTION:A compsn. comprising a polyphenylene oxide [e.g. poly(2,6- dimethyl-1,4-phenylene oxide)], a crosslinker (e.g. triallyl isocyanurate), and an initiator (e.g. Perbutyl P) is compounded with an inorg. filler (e.g. CaCO3) to give the title material, which gives a molded article exhibiting excellent electrical properties in a high-frequency region because of low dielectric constant and dielectric dissipation factor inherent in the polyphenylene oxide. The polyphenylene oxide compounded is crosslinked by the crosslinker to give a highly heat-resistant crosslinked polymer, and the inorg. filler compound strengths the resistance to heat distortion, thus giving a molded article with a high heat resistance.
Inventors:
MIYOSHI KEIJI
IKOMA SUNAO
IKOMA SUNAO
Application Number:
JP6501590A
Publication Date:
November 26, 1991
Filing Date:
March 15, 1990
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08L71/12; H01B3/42; (IPC1-7): C08L71/12; H01B3/42
Attorney, Agent or Firm:
Ishida Chochichi (2 outside)
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