POLYPROPYLENE RESIN COMPOSITION AND EXPANSION MOLDED FORM THEREOF

Title:

POLYPROPYLENE RESIN COMPOSITION AND EXPANSION MOLDED FORM THEREOF

Document Type and Number:

Japanese Patent JP2004307665

Kind Code:

A

Abstract:

To obtain a polypropylene resin composition suitable for producing an expansion molding reduced in swirl marks problematic in injection expansion molding.

The polypropylene resin composition comprises (A) 50-100 mass% of polypropylene, (B) 0-50 mass% of an ethylene-α-olefin copolymer, (C) 0-25 mass% of talc and (D) a foaming agent, wherein the compounding amount of the component D is 0.3-2.0 pt(s). mass based on 100 pts. mass of the total of the components A, B and C. For the component A, a blend of the components A and B, or a blend of the components A, B and C, the melt index(MI) determined at 230°C is 30-100 g/10min and the capillary swell d/d0( (d) is resin expansion diameter, and d0 is die diameter ) is ≥1.8 at 190°C and at a shearing rate of 1,220 s-1.

Inventors:

YAMAZAKI YASUNOBU
HIRANO KOKI
TANAKA TAKAYOSHI
SHIMIZU YASUYUKI
KONDO DAIYU

Application Number:

JP2003103935A

Publication Date:

November 04, 2004

Filing Date:

April 08, 2003

Export Citation:

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Assignee:

IDEMITSU PETROCHEMICAL CO
TAKANICHI KK

International Classes:

C08J9/04; C08K3/34; C08L23/10; (IPC1-7): C08L23/10; C08J9/04; C08K3/34

Attorney, Agent or Firm:

Tamotsu Otani

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