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Title:
POLYPROPYLENE RESIN COMPOSITION FOR INORGANIC PHYSICAL EXPANSION MOLDING, AND FOAMED ARTICLE THEREOF
Document Type and Number:
Japanese Patent JP2011168695
Kind Code:
A
Abstract:

To provide a polypropylene resin composition for inorganic physical expansion molding capable of obtaining a fine foamed article having fine and uniform bubbles having, for example, an average cell diameter of 1,000 nm or less, and a foamed article thereof.

The polypropylene resin composition for the inorganic physical expansion molding contains a graft copolymer comprising a polymer of an ethylenic unsaturated monomer (b) having a polypropylene resin (a) as a main chain component and a (meth)acrylate or vinyl carboxylate as a side chain component. The polymer of the ethylenic unsaturated monomer (b) constituting the graft copolymer is a crosslinked product in which a number average dispersed particle diameter is 100-1,000 nm and standard deviation relative to the average dispersed particle diameter is 5-20%.


Inventors:
TAKAMURA MASUMI
MIMA KAZUAKI
Application Number:
JP2010033804A
Publication Date:
September 01, 2011
Filing Date:
February 18, 2010
Export Citation:
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Assignee:
NOF CORP
International Classes:
C08L51/06; C08F255/02; C08J9/12
Domestic Patent References:
JPH06136070A1994-05-17
JPS50139166A1975-11-06
JP2002338778A2002-11-27
JP2002338778A2002-11-27
Attorney, Agent or Firm:
Hironobu Onda
Makoto Onda