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Title:
POLYPROPYLENE RESIN COMPOSITION FOR VAPOR-DEPOSITED FILM AND FILM COMPRISING THE SAME
Document Type and Number:
Japanese Patent JP2009149753
Kind Code:
A
Abstract:

To provide a polypropylene-based resin composition excellent in heat resistance, transparency and a balance between sliding property and low temperature impact resistance.

This polypropylene-based resin composition containing a polypropylene-based copolymer comprises: 50 to 95% by weight of a polymer component (component A) containing propylene as a main component and having a melting point of higher than 155C; and 5 to 50% by weight of a copolymer component (component B) of propylene, ethylene and a 4C -olefin in which: the content (X) of a structure unit derived from propylene is 10% by weightX50% by weight; the content (Y) of a structure unit derived from ethylene is 50% by weightY70% by weight; the content (Z) of a structure unit derived from a 4C -olefin is 0% by weightZ20% by weight (with the proviso that the total of X, Y and Z is 100% by weight); and the weight ratio of the content (Z) of a structure unit derived from the 4C -olefin relative to the content (X) of a structure unit derived from propylene is 1 or less.


Inventors:
IKEDA KENJI
KIDAI SHIGEKI
Application Number:
JP2007328407A
Publication Date:
July 09, 2009
Filing Date:
December 20, 2007
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO
International Classes:
C08L23/10; C08K3/22; C23C14/20
Domestic Patent References:
JP2006052315A2006-02-23
JPS5552333A1980-04-16
JPS5911249A1984-01-20
JPH03293123A1991-12-24
JPH09241447A1997-09-16
JP2004175884A2004-06-24
Attorney, Agent or Firm:
Toru Nakayama