NEW MATERIAL: A polythiol of formula I [wherein R is a (substituted) aromatic group, methylenebisphenyl, xylylene, a (substituted) cycloaliphatic group, methylenebisdicyclohexyl, dimethylenecyclohexyl, methylenecyclohexyl or an aliphatic group; A is N or O; X is -H or -R'SH; R' is an alkylene, a cycloalkylene or an alkylene-substituted aromatic group; b is 1 when A is O and is 2 when A is N].
EXAMPLE: A compound of formula II.
USE: Useful as an excellent curing agent for epoxy resins. When this is used as a curing agent for an epoxy resin, the resin can be cured within a short gelation time, shows an improved curing rate and can give a product having good heat resistance, chemical resistance and water absorption resistance. Useful for various applications such as films, casting agents and adhesives.
PREPARATION: A compound of formula III is reacted with, for example, a stoichiometrically excessive amount of hydrogen sulfide to obtain a compound of formula I.
SUCHIYUAATO HAATOMAN
RIYUUBEN GURINSUTEIN
REIMONDO DARAGO
