Title:
POROUS POLYAMIDEIMIDE FILM AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2016145300
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a porous polyamideimide film excellent in heat resistance, having high porosity, and having fine pores formed and a manufacturing method therefor.SOLUTION: (1)There is provided a porous polyamideimide film obtained by a dry porous process, consisting of polyamideimide containing an oxyalkylene unit and having porosity of 20 vol.% to 95 vol.% and an average pore diameter of 10 nm to 1000 nm. (2)There is provided a manufacturing method of the porous polyamideimide film by drying at a temperature of 200°C or less after applying a solution containing polyamideimide containing the oxyalkylene unit, a good solvent and a poor solvent thereof onto a substrate.SELECTED DRAWING: None
More Like This:
Inventors:
YAMADA MUNENORI
SHIBATA KENTA
TAKEUCHI KO
YOSHINO FUMIKO
SHIGETA AKIRA
ECHIGO YOSHIAKI
SHIBATA KENTA
TAKEUCHI KO
YOSHINO FUMIKO
SHIGETA AKIRA
ECHIGO YOSHIAKI
Application Number:
JP2015023261A
Publication Date:
August 12, 2016
Filing Date:
February 09, 2015
Export Citation:
Assignee:
UNITIKA LTD
International Classes:
C08J9/28
Domestic Patent References:
| JP5944613B1 | 2016-07-05 |
Previous Patent: CONDUCTIVE MATERIAL AND CONDUCTOR USING IT
Next Patent: ADDITION REACTION CURABLE LIQUID SILICONE RUBBER COMPOSITION
Next Patent: ADDITION REACTION CURABLE LIQUID SILICONE RUBBER COMPOSITION