Title:
ポジ型感光性組成物
Document Type and Number:
Japanese Patent JP5238023
Kind Code:
B2
Abstract:
Disclosed is a positive-type photosensitive composition which can form a metal compound film pattern at high resolution and with less affection by organic residues. The positive-type photosensitive composition comprises: a metal complex component (A) which can form a metal compound film when applied and subsequently fired; and a photosensitizing agent (B). In the composition, a ligand in the component (A) is preferably a multidentate ligand having an aromatic compound as its skeleton. According to this construction, even a composition containing substantially no photosensitive resin can impart photosensitivity and a metal compound film pattern can be formed readily.
Inventors:
Takahashi Motoki
Toshiyuki Ogata
Cordonier Christopher
Ryomasa Nakamura
Tetsuya Shichi
Uematsu Teruhiro
Toshiyuki Ogata
Cordonier Christopher
Ryomasa Nakamura
Tetsuya Shichi
Uematsu Teruhiro
Application Number:
JP2010512005A
Publication Date:
July 17, 2013
Filing Date:
May 13, 2009
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
Tokai Passenger Railway Co., Ltd.
Tokai Passenger Railway Co., Ltd.
International Classes:
G03F7/004; G03F7/022; H01B5/14
Domestic Patent References:
JPH11278869A | 1999-10-12 | |||
JPH11256342A | 1999-09-21 | |||
JPH09237518A | 1997-09-09 | |||
JP2003255522A | 2003-09-10 | |||
JP2002358824A | 2002-12-13 | |||
JP2002015631A | 2002-01-18 | |||
JP2001143526A | 2001-05-25 | |||
JP2006344479A | 2006-12-21 | |||
JPH09263969A | 1997-10-07 | |||
JPH11278869A | 1999-10-12 | |||
JPH11256342A | 1999-09-21 | |||
JPH09237518A | 1997-09-09 | |||
JP2003255522A | 2003-09-10 | |||
JP2002358824A | 2002-12-13 | |||
JP2002015631A | 2002-01-18 | |||
JP2001143526A | 2001-05-25 |
Foreign References:
WO2008007469A1 | 2008-01-17 |
Attorney, Agent or Firm:
Masayuki Masabayashi