Title:
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2008191574
Kind Code:
A
Abstract:
To provide a positive photosensitive resin composition excellent in adhesion to a substrate in a development step and after moisture treatment and in storage stability, a cured film composed of a cured product of the positive photosensitive resin composition, a protective film and an insulating film composed of the cured film, a semiconductor device and a display device.
The positive photosensitive resin composition comprises an alkali-soluble resin (A), a photosensitive diazonaphthoquinone compound (B) and a silicon compound (C-1) represented by general formula (1).
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Inventors:
SUGIYAMA HIROMICHI
Application Number:
JP2007028251A
Publication Date:
August 21, 2008
Filing Date:
February 07, 2007
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
G03F7/075; G03F7/023; H01L21/027; C09D5/00; C09D5/25; C09D7/12; C09D177/06; C09D183/06; C09D201/00
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