POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND MANUFACTURE OF RELIEF PATTERN

Japanese Patent JP3436673

B2

PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition high in sensitivity to active light and capable of forming a satisfactory pattern by using an alkaline water solution as developer, and to form a satisfactory relief pattern by active light exposure and by development using the alkaline developer.
SOLUTION: In a positive photosensitive resin composition including a polyamide acid ester containing a repetition unit expressed by a formula (in the formula, R1 stands for a quadrivalent organic radical, R2 and R3 for hydro-carbon radicals, R4 for a divalent organic radical having a phenolic hydroxyl radical or a carboxyl radical), and a compound producing an acid by light, a dissolving rate of a film formed of this resin composition in an alkaline water solution is 30 nm/sec or under while a dissolving speed thereof is 80 nm/sec or upper when active light is applied thereto by 700 mJ/cm2 on the same coating/drying conditions, and, in a manufacturing method of a relief pattern, this resin composition is spread over a substrate, dried, thereafter irradiated with active light, developed by the alkaline water solution, and heated.

Mamoru Sasaki
Masataka Nunomura
Masayuki Ohe
Shunichiro Uchimura

JP33981697A

August 11, 2003

December 10, 1997

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Hitachi Chemical Co., Ltd.

G03F7/022; G03F1/08; G03F7/023; G03F7/027; G03F7/028; G03F7/037; G03F7/039; H01L21/027; (IPC1-7): G03F7/039; G03F1/08; G03F7/027; G03F7/028; H01L21/027

JP3158856A
JP5224411A
JP822118A
JP4218051A
JP3115461A
JP4168441A
JP11106651A
JP11223940A
JP1124270A

【文献】国際公開93/09470(WO,A1)

Yoshiki Hasegawa (2 outside)

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