Title:
POSITIVE RESIST COMPOSITION FOR MANUFACTURE OF PHOTOMASK
Document Type and Number:
Japanese Patent JPH11218908
Kind Code:
A
Abstract:
To provide the resist for forming a practicable photomask superior in sensitivity and resolution and pattern shape in drawing with ionized radiation (mainly electron beams).
This resist composition contains an alkali-soluble phenol resin, a polyphenol-quinonediazide-sulfonic acid ester, a phenol compound, and a solvent. The alkali-soluble phenol resin is prepared by using a cresol mixture of 10-45 weight % m-cresol, and 90-55 weight % p-cresol, and the above ester is prepared by esterifying ≥75% of the phenolic hydroxyl groups of the polyphenol compound with 1,2-naphthoquinonediazide-4-sulfonic acid.
Inventors:
KATOU JIYOUKEI
Application Number:
JP3799898A
Publication Date:
August 10, 1999
Filing Date:
February 04, 1998
Export Citation:
Assignee:
NIPPON ZEON CO
International Classes:
G03F7/023; H01L21/027; (IPC1-7): G03F7/023; H01L21/027