Title:
POWER CONVERSION DEVICE
Document Type and Number:
Japanese Patent JP2017229229
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To make it possible to secure maintainability while suppressing a thermal influence from a cooling body's installation face to which a semiconductor element is installed.SOLUTION: A power conversion device (10) comprises: a semiconductor element (17) for performing power conversion; and a cooling body (12) for discharging heat of the semiconductor element. The cooling body comprises an installation face (12c) on which the semiconductor element is installed. On the installation face is provided a spacer (18) so as to surround the semiconductor element, thereby separating various types of components from the installation face to be a heat source by the spacer's thickness to reduce a quantity of heat propagating to the various types of components. The installation face's part surrounded by the spacer includes a space in which the semiconductor element is not installed, the space being filled with a heat insulation member (19) to enable suppression of an influence of heat emitted from the installation face.SELECTED DRAWING: Figure 2
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Inventors:
HAYASHI KAZUKI
Application Number:
JP2017118031A
Publication Date:
December 28, 2017
Filing Date:
June 15, 2017
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD
International Classes:
H02M7/48
Domestic Patent References:
| JP2000014169A | 2000-01-14 | |||
| JP2005341630A | 2005-12-08 | |||
| JP2008004755A | 2008-01-10 | |||
| JP2015019463A | 2015-01-29 |
Foreign References:
| WO2006001163A1 | 2006-01-05 | |||
| US20060039127A1 | 2006-02-23 |
Attorney, Agent or Firm:
Hiroyoshi Aoki
Amada Masayuki
Yoshimasa Okada
Masaaki Kitagawa
Amada Masayuki
Yoshimasa Okada
Masaaki Kitagawa