Title:
パワーデバイス封止用樹脂組成物およびパワーデバイス
Document Type and Number:
Japanese Patent JP7255633
Kind Code:
B2
Abstract:
Provided is an encapsulating resin composition for a power device including an epoxy resin, an inorganic filler, a curing agent, and a curing accelerator. This composition is molded under a condition of 175°C for 2 minutes and then subjected to after-curing under a condition of 175°C for 4 hours to obtain a test piece having a diameter of 100 mm and a thickness of 2 mm, and a half width of a current-time curve obtained by measuring the test piece with a thermally stimulated depolarization current method according to an order of (i) to (v) below is equal to or less than 800 seconds, (i) increase a temperature of the test piece to 150°C at a rate of 5°C/min without applying a voltage, (ii) applying a constant voltage of 500 V for 30 minutes while maintaining the temperature of the test piece at 150°C, (iii) lower the temperature of the test piece to 45°C at a rate of 5°C/min while applying the constant voltage of 500 V, (iv) stop applying the voltage while maintaining the temperature of the test piece at 45°C and leave the test piece to stand for 5 minutes, and (v) increase the temperature of the test piece at a rate of 3.5°C/min without applying a voltage to the test piece, and measure a value of a current flowing during the increase in the temperature to obtain a current-time curve.
Inventors:
Tetsuya Kitada
Application Number:
JP2021079008A
Publication Date:
April 11, 2023
Filing Date:
May 07, 2021
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
H01L23/29; C08G59/20; C08G59/40; C08K3/36; C08K9/04; C08L63/00; H01L23/31
Domestic Patent References:
| JP2014062172A |
Foreign References:
| WO2006011662A1 | ||||
| WO2014065152A1 | ||||
| WO2018015981A1 |
Attorney, Agent or Firm:
Shinji Hayami