Title:
電源モジュールおよび質量分析装置
Document Type and Number:
Japanese Patent JP7168542
Kind Code:
B2
Abstract:
The performance of a power supply module is to be improved. The occurrence of discharge in the power supply module is to be prevented, and the size of the power supply module is to be reduced. In a power supply module, substrates are provided being stacked in a planar view. A low voltage circuit and a high voltage circuit are formed on a first substrate such that a distance is kept for preventing surface discharge, and a low voltage circuit is formed on a second substrate. A distance between a component of a high voltage alternating current circuit on the high voltage circuit and a component of the low voltage circuit is three times a shortest distance, at which space discharge does not occurs, between a component that constitutes a high voltage direct current circuit on the high voltage circuit and a component that constitutes the low voltage circuit.
Inventors:
Ong Jihao
Takuma Nishimoto
Furuya Yuuo
Hiroshi Nita
Takuma Nishimoto
Furuya Yuuo
Hiroshi Nita
Application Number:
JP2019190656A
Publication Date:
November 09, 2022
Filing Date:
October 18, 2019
Export Citation:
Assignee:
Hitachi High-Tech Co., Ltd.
International Classes:
H02M3/28; H01J49/10; H01J49/26; H01J49/42
Domestic Patent References:
| JP2011067093A | ||||
| JP7099777A |
Foreign References:
| KR1020170072037A | ||||
| US20050205970 |
Attorney, Agent or Firm:
Patent Attorney Tsutsui International Patent Office
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