Title:
POWER SUPPLY APPARATUS
Document Type and Number:
Japanese Patent JP2010110174
Kind Code:
A
Abstract:
To provide a power supply apparatus which efficiently prevents warpage even on a printed wiring board having a large ratio of long-side to short-side to effectively perform heat dissipation while securing a broad mounting area of chip components.
The power supply apparatus includes: the printed wiring board 1 including a first region with AC circuit components and a second region with DC circuit components and being formed to have a longitudinal direction; a first heat dissipation board 2 erected in the first region on the printed wiring board; and a second heat dissipation board 3 erected in the second region on the printed wiring board 1.
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Inventors:
OKABASHI TETSUYOSHI
Application Number:
JP2008281889A
Publication Date:
May 13, 2010
Filing Date:
October 31, 2008
Export Citation:
Assignee:
SHARP KK
International Classes:
H02M7/04; H05K7/20; H05K9/00
Domestic Patent References:
| JPH02799U | 1990-01-05 | |||
| JPS5735097U | 1982-02-24 | |||
| JP2005303228A | 2005-10-27 | |||
| JP2002290085A | 2002-10-04 | |||
| JPH0641192U | 1994-05-31 | |||
| JPS6221593U | 1987-02-09 |
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Nobuo Arakawa
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Nobuo Arakawa
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