Title:
PREPREG AND MANUFACTURING METHOD OF WIRING BOARD
Document Type and Number:
Japanese Patent JP2017066297
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a prepreg capable of suppressing deterioration of thickness accuracy due to variation of density of a conductor wire in a core material when laminated on the core material for manufacturing a wiring board and enhancing filling property of a resin composition in gaps between the conductor wires.SOLUTION: The prepreg 1 has a woven fabric substrate 2 and a resin composition 3 impregnated in the substrate 2. Opening ratio of the substrate 2 is in a range of 3 to 35%. Viscosity of the resin composition 3 measured by a dynamic viscoelasticity under a condition of temperature rise rate in a range of 0.5 to 8°C/min. and frequency of 0.5 Hz is in a range of 10to 10Pa s at any temperature in a range of 90 to 180°C.SELECTED DRAWING: Figure 1
Inventors:
SUZUKI FUMITO
MITO TAKATOSHI
KONUMA NORIKO
MIDORIKAWA HIROFUMI
FUJINO KENTARO
YONEMOTO TATSUO
MOTOBE EIJI
MITO TAKATOSHI
KONUMA NORIKO
MIDORIKAWA HIROFUMI
FUJINO KENTARO
YONEMOTO TATSUO
MOTOBE EIJI
Application Number:
JP2015194427A
Publication Date:
April 06, 2017
Filing Date:
September 30, 2015
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
C08J5/24
Attorney, Agent or Firm:
Patent business corporation Hokuto patent office
Keisei Nishikawa
Mizuhiji Katsuhisa
Yoshishige Takeo
Keisei Nishikawa
Mizuhiji Katsuhisa
Yoshishige Takeo