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Title:
PRECISION POLISHING METHOD
Document Type and Number:
Japanese Patent JPS6288566
Kind Code:
A
Abstract:

PURPOSE: To reduce working cost by arranging a polisher provided on the front layer of an electrode board and a workpiece moved relatively to said polisher in polishing liquid to attract and hold abrasives to the surface of the polisher by cataphoresis under the influence of electric field.

CONSTITUTION: A polisher provided on the front surface of a turnable electrode board 10 with a fine nap material 9 and a workpiece 8 pressed against the surface of the polisher by predetermined pressure to be relatively moved are arranged in polishing liquid 13 suspending fine abrasive grains 11. An electrode plate 12 is provided in the polishing liquid 13 opposedly to the electrode 10. Under the influence of electric field between both electrodes 10, 12 the fine abrasive grains 11 in the polishing liquid 13 are concentrated on the surface of polisher by the cataphoresis to promote polishing so that extremely high speed working can be carried out without losing advantages of non-contact polishing method and mass productivity improved while a satisfactory finished polished surface can be efficiently attained.


Inventors:
IMANAKA OSAMU
KUROBE TOSHIJI
NAKADA KUNIO
UEDA SHUJI
Application Number:
JP23016785A
Publication Date:
April 23, 1987
Filing Date:
October 16, 1985
Export Citation:
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Assignee:
IMANAKA OSAMU
KUROBE TOSHIJI
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B24B37/00; (IPC1-7): B24B37/00
Domestic Patent References:
JPS57163055A1982-10-07
Attorney, Agent or Firm:
Toshio Nakao (2 outside)