PURPOSE: To easily mold a label into a solid form by sucking and holding heat- bonding labels expanded into a plane one by one by a simulation mold having a vacuum-suction means at a bottom, and then lowering wherein the label is folded inward by guides to have it fit to the simulation mold at the time of lowering.
CONSTITUTION: Heat-bonding labels 100 expanded into a plane are sucked one by one by a simulation mold 1 having a suction pad 1 of a vacuum-suction means 9 at a bottom and held at a predetermined position. A rod 4 is lowered by a cylinder or the like in this state to move the simulation mold 1 along guides 10b, 103 for guiding sides 102 to 105 of the label 100. The respective sides 102 to 105 are folded inward by the guides 10b, 10d at this time to have the label fit to a shape of the mold 1. Then joints of the label 100 are heated and fused by a heat-sealing pad. After fusing, cylinders 13, 23 are retreated, and then the simulation mold 1 is raised to take out the preformed label 100.
KOJIMA MASASHI
YOSHIKOSHI AKIO
| JPH04135833A | 1992-05-11 | |||
| JPS4939398B1 | 1974-10-25 |
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