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Patent Searching and Data


Title:
PREPARATION OF ROOM-TEMPERATURE-CURING AQUEOUS RESIN DISPERSION
Document Type and Number:
Japanese Patent JPH08188606
Kind Code:
A
Abstract:

PURPOSE: To obtain a room-temperature-curing aqueous resin dispersion having a film Tg in a specified range, excellent water resistance and good contact by emulsion-polymerizing a radical-polymerizable monomer in the presence of an epoxy resin and an oil-soluble polymerization initiator in an aqueous medium.

CONSTITUTION: A radical-polymerizable monomer is emulsion polymerized in an amount of 40-80 pts.wt. in the presence of 20-60 pts.wt. epoxy resin and an oil-soluble polymerization initiator in an aqueous medium to obtain a room- temperature-curing aqueous resin dispersion which can give a film of a Tg of 10 to -40°C. As the radical initiator is used, this composition has good water resistance and good contact as compared with a conventional aqueous resin dispersion being a combination with an epoxy resin. Further, it can be smoothly cured with an epoxy resin into a highly heat-resistant product and has performance equivalent to that of a solvent-based chloroprene adhesive.


Inventors:
OTSUKA MASAHIKO
YOSHITOMI NOBUKO
Application Number:
JP277595A
Publication Date:
July 23, 1996
Filing Date:
January 11, 1995
Export Citation:
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Assignee:
ASAHI CHEMICAL IND
International Classes:
C08F2/22; C08F2/44; C08F290/00; C08F290/06; C08G59/17; C08G59/40; (IPC1-7): C08F2/44; C08F2/22; C08F290/06; C08G59/17; C08G59/40