Title:
PREPREG FOR BONDING AND SEMICONDUCTOR-MOUNTING MULTILAYER BOARD MADE THEREOF
Document Type and Number:
Japanese Patent JPH04261438
Kind Code:
A
Abstract:
PURPOSE:To provide a bonding prepreg composed of a specific resin varnish and glass cloth, having excellent embedding performance of inner-layer circuit and causing little entrainment of bubbles and flow-out of the resin and suitable for a multilayer board for mounting semiconductors. CONSTITUTION:The objective prepreg is composed of an opened glass cloth and an epoxy resin varnish having a gel time of 20+ or -10sec. The resin content of the prepreg is 55+ or -5%. One or two prepreg sheets are used as each bonding layer of a semiconductor-mounting multilayer board containing inner-layer circuit. The opening treatment of the glass cloth is preferably carried out by ejecting high-pressure water-jet of 30-150kg/cm<2> pressure.
Inventors:
MURAKOSHI SUKEJI
SUZUKI YOSHIHARU
KATO SHIGERU
HASUNUMA MASAHIKO
HATANAKA HIDEYUKI
SUZUKI YOSHIHARU
KATO SHIGERU
HASUNUMA MASAHIKO
HATANAKA HIDEYUKI
Application Number:
JP29094390A
Publication Date:
September 17, 1992
Filing Date:
October 30, 1990
Export Citation:
Assignee:
NITTO BOSEKI CO LTD
ASAKA DENSHI KK
ASAKA DENSHI KK
International Classes:
B32B17/04; C08J5/24; H01L23/14; H05K1/00; H05K1/03; (IPC1-7): B32B17/04; C08J5/24
Attorney, Agent or Firm:
Akira Asamura (3 outside)
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