To provide a prepreg capable of corresponding to formation of a thin film and imparting different elastic modulus to both surfaces of prepreg and a circuit board and a semiconductor device each having the above prepreg.
The prepreg has a core layer of a sheet-like base material, a first resin layer formed on either one side of the core layer and a second resin layer formed on the other side of the core layer and forms a conductor layer on the first resin layer. In the prepreg, a first resin composition constituting the first resin layer is different from a second resin composition constituting the second resin layer and a modulus after thermal curing of the first resin layer is 4 GPa at 20C. The circuit board is obtained by laminating prepregs described above. The semiconductor device has the circuit board described above.
HOZUMI TAKESHI
YUASA MADOKA
| JPH03139531A | 1991-06-13 | |||
| JPH08258162A | 1996-10-08 | |||
| JP2003313324A | 2003-11-06 |