Title:
PREPREG, LAMINATE, MULTILAYER PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE AND RESIN COMPOSITION, AND METHOD OF MANUFACTURING PREPREG, LAMINATE AND MULTILAYER PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2023134512
Kind Code:
A
Abstract:
To provide prepreg, laminate, multilayer printed wiring board, and semiconductor package capable of exhibiting high adhesion to conductor, excellent heat resistance, high glass transition temperature, low coefficient of thermal expansion, and flame resistance, as well as stable and excellent high frequency characteristics (dielectric properties in high frequency bands), and also, to provide a resin composition capable of providing the prepreg, and further, to provide a method for manufacturing the prepreg, the laminate, and the multilayer printed wiring board.SOLUTION: Prepreg containing a resin composition and a sheet fiber reinforced base material, the amount of outgas generated when heated at a temperature of 163°C for 15 minutes is less than 0.7 mass% of the prepreg as a whole.SELECTED DRAWING: None
Inventors:
SHIRONO KEITA
KANEKO TATSUNORI
KAMOSHITA SHINICHI
SHIMIZU HIROSHI
SOTOZAKI YUKIMASA
SHIRAOKAWA YOSHIKATSU
KANEKO TATSUNORI
KAMOSHITA SHINICHI
SHIMIZU HIROSHI
SOTOZAKI YUKIMASA
SHIRAOKAWA YOSHIKATSU
Application Number:
JP2023104177A
Publication Date:
September 27, 2023
Filing Date:
June 26, 2023
Export Citation:
Assignee:
RESONAC HOLDINGS CORP
International Classes:
B29B11/16; C08F299/00; C08G65/48; H05K1/03
Attorney, Agent or Firm:
Patent Attorney Corporation Otani Patent Office