Title:
PREPREG AND LAMINATED PLATE FOR LAZER PROCESSING BY USING IT
Document Type and Number:
Japanese Patent JP2002003627
Kind Code:
A
Abstract:
To provide a laminated plate on which a non-through hole with more uniform hole-diameter can be formed at lazer processing, and provide a prepreg capable of preparing the laminated plate.
Prepreg 1 is prepared by impregnating a resin composition containing a thermosetting resin into glass base material 2 and by semi-curing a resin portion of the resin composition. The glass base material 2 has the thickness of 20-80 μm and permeability of 1-100 cm3/cm2/sec. The laminated plate is prepared by heating and molding prepreg 1 and curing the resin to form an insulating layer.
Inventors:
YAMANOUCHI KENGO
TAKADA TOSHIHARU
TAKADA TOSHIHARU
Application Number:
JP2000185562A
Publication Date:
January 09, 2002
Filing Date:
June 21, 2000
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08J5/24; H05K1/03; H05K3/46; (IPC1-7): C08J5/24; H05K1/03
Attorney, Agent or Firm:
Junji Ando (1 person outside)