Title:
電子部品のスズ表面における半田付け性の保存及びウイスカ成長の阻止
Document Type and Number:
Japanese Patent JP2007519261
Kind Code:
A
Abstract:
A method for reducing whisker formation and preserving solderability in tin coatings over metal features of electronic components. The tin coating has internal tensile stress and is between about 0.5 m and about 4.0 m in thickness. There is a nickel-based layer under the tin coating.
Inventors:
Sue, Chen
Chan, Yun
Jungrun, fan
Car Celebrity, Oscar
Abyss, Joseph, A.
Eric, Warsh
Kleinfeld, Marlyth
Eckhart, Hans, Ulrich
Chan, Yun
Jungrun, fan
Car Celebrity, Oscar
Abyss, Joseph, A.
Eric, Warsh
Kleinfeld, Marlyth
Eckhart, Hans, Ulrich
Application Number:
JP2006551316A
Publication Date:
July 12, 2007
Filing Date:
January 21, 2005
Export Citation:
Assignee:
Enton Incorporated
International Classes:
H01L23/50; C25D5/12; H01L23/495; H01R13/03; H05K3/34; H01G4/228; H01R4/02
Domestic Patent References:
| JP2003049293A | 2003-02-21 | |||
| JP2002302790A | 2002-10-18 | |||
| JP2000144482A | 2000-05-26 |
Attorney, Agent or Firm:
Teruo Akimoto