Title:
PRESSURE CONTROL DEVICE OF COMPONENT MOUNTING DEVICE
Document Type and Number:
Japanese Patent JP2680773
Kind Code:
B2
Abstract:
PURPOSE: To provide a component mounting device of simple structure which is able to accurately control pressure applied onto a component.
CONSTITUTION: In a component mounting device which mounts an electronic component on the surface of a printed board with a suction head mechanism 4 linked to a head lift mechanism, a pressure sensor 6 is provided to measure pressure which acts on the electronic component attendant on a mounting operation, a microcomputer 1 forms control signals corresponding to the difference between a target value and a measured value of pressure applied onto the electronic component, and a head lift motor 51 is controlled in rotary speed basing on the control signal concerned.
Inventors:
Toshikashi Nio
Hashimoto Masahiko
Akira Sakaguchi
Kunimitsu Michio
Hashimoto Masahiko
Akira Sakaguchi
Kunimitsu Michio
Application Number:
JP20115492A
Publication Date:
November 19, 1997
Filing Date:
July 28, 1992
Export Citation:
Assignee:
Sanyo Electric Co., Ltd.
International Classes:
B23P19/02; B23P21/00; H05K13/04; (IPC1-7): H05K13/04; B23P21/00
Domestic Patent References:
| JP6255947A | ||||
| JP61216388A |
Attorney, Agent or Firm:
Toshiyuki Maruyama (3 others)