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Title:
PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE SHEET, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2009203337
Kind Code:
A
Abstract:

To achieve high package reliability even if a package, to which a semiconductor chip is mounted, is exposed to high temperature and high humidity or exposed to high temperature and high humidity under voltage application.

The pressure-sensitive adhesive composition comprises an acrylic polymer (A), an epoxy resin (B) having an epoxy equivalent of 180 g/eq or less, a curing agent (C), and an ion scavenger (D). The content of the ion scavenger (D) is 1-20 pts.wt. for 100 pts.wt. of all the resin components.


Inventors:
SHIZUHATA HIRONORI
SHINODA TOMONORI
KOYAKATA MASAHIRO
Application Number:
JP2008046591A
Publication Date:
September 10, 2009
Filing Date:
February 27, 2008
Export Citation:
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Assignee:
LINTEC CORP
International Classes:
C09J133/00; C09J7/02; C09J11/04; C09J11/06; C09J11/08; C09J163/00; H01L21/301; H01L21/52
Domestic Patent References:
JP2006269887A2006-10-05
JP2003206464A2003-07-22
JP2007277525A2007-10-25
JP2001345349A2001-12-14
Attorney, Agent or Firm:
Shunichiro Suzuki
Koji Makimura
Chihata Takahata



 
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