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Patent Searching and Data


Title:
PRESSURE SENSITIVE ADHESIVE LABEL FROM WHICH PART OF SUBSTRATE IS PEELABLE
Document Type and Number:
Japanese Patent JP2001051606
Kind Code:
A
Abstract:

To smoothly separate a pressure sensitive adhesive label stuck once and to perform various communication after separation by forming a perforated line in a substrate in such a way that the substrate can be divided into 1st and 2nd areas, laminating a peelable layer between the substrate and a barrier layer in the 1st area and forming a slit in the peelable layer and the barrier layer in a terminal region in which a pressure sensitive adhesive layer is not formed.

A perforated line 7 is formed in a substrate 2 in such as a way that the substrate 2 can be divided into a 1st area which is a release chip 12 for a chit where a seal is stamped and a 2nd area which is a tag 11. In the part of the release chip 12 for a chip, peeling takes place between a peelable layer 5 and a barrier layer 3. The barrier layer 3 stably retain peelability, that is, weak adhesive power between the barrier layer 3 and the peelable layer 5 disposed between the substrate 2 and the barrier layer 3 in the part of the release chip 12 for a chit. In a region 9 in which a pressure sensitive adhesive layer 4 is not formed in the release chip 12 for a chit, a slit 10 is formed in a design printed layer 8, the barrier layer 3 and the peelable layer 5.


Inventors:
ANDO REIKO
Application Number:
JP22302399A
Publication Date:
February 23, 2001
Filing Date:
August 05, 1999
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
G09F3/10; G09F3/00; G09F3/02; (IPC1-7): G09F3/10; G09F3/00; G09F3/02
Attorney, Agent or Firm:
Satoshi Kanayama