Title:
PRESSURE-SENSITIVE ADHESIVE SHEET FOR STICKING WAFER
Document Type and Number:
Japanese Patent JPH09111200
Kind Code:
A
Abstract:
To prepare a pressure-sensitive adhesive sheet which is used when a semiconductor wafer is cut and separated into small pieces of element, can firmly fix a wafer during cutting, and rapidly loses the adhesive power after irradiation with a radiation.
This sheet is obtained by forming a pressure-sensitive adhesive layer consisting of a pressure-sensitive adhesive resin and a radiation- polymerizable compound on a base material, and the pressure-sensitive adhesive resin used is the one having a photopolymerization initiator bonded to the main chain and/or the side chain thereof.
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Inventors:
NAKASAKI SUNAO
YOSHIZAWA KATSUAKI
YOSHIZAWA KATSUAKI
Application Number:
JP27220495A
Publication Date:
April 28, 1997
Filing Date:
October 20, 1995
Export Citation:
Assignee:
OJI PAPER CO
International Classes:
C09J7/02; C09J4/00; C09J133/00; C09J201/02; H01L21/301; (IPC1-7): C09J7/02; C09J7/02; H01L21/301