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Title:
PRESSURE-SENSITIVE TRANSFER ADHESIVE TAPE
Document Type and Number:
Japanese Patent JP2006143776
Kind Code:
A
Abstract:

To provide a pressure-sensitive transfer adhesive tape in which no support body exists before transfer and microcapsules contained in the adhesive are destroyed after transfer to bring about curing reaction and a core is formed.

The pressure-sensitive transfer adhesive tape has not less than two layers containing an adhesive on the substrate. Microcupsules separately encapsulating two components which bring about curing reaction upon contact with each other exist in at least one interlayer of the adhesive-containing layers.


Inventors:
SAKAI NAOTO
Application Number:
JP2004332039A
Publication Date:
June 08, 2006
Filing Date:
November 16, 2004
Export Citation:
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Assignee:
TOMBOW PENCIL
International Classes:
C09J7/02
Domestic Patent References:
JP2004091769A2004-03-25
JP2003292932A2003-10-15
JPH09176594A1997-07-08
JPS5619544U1981-02-20
JPH09291260A1997-11-11
JPH0711211A1995-01-13
JP2001271041A2001-10-02
Attorney, Agent or Firm:
Hiroshi Tanaka
Eishiro Higuchi
Harumi Miyamoto