PRESSURE-WELDED BOILING COOLER OR ITS SEALING METHOD OR ITS STACK STRUCTURE

Japanese Patent JP3858514

B2

PROBLEM TO BE SOLVED: To easily machine and seal the cooler of a boiling and cooling apparatus and to take sufficient insulation and corrosion measures even when a conductive refrigerant is used, by machining in such a way that many angular parts exist in contact parts with the refrigerant in connecting holes.
SOLUTION: An upper-side recessed part 11 is worked in the upper end part of a cooling body 10 whose outside shape has a rectangular parallelepiped shape, and a lower-side recessed part 12 is machined in its lower end part. A plurality of connecting holes 13 which connect the upper-side recessed part 11 to the lower-side recessed part 12 are opened. Then, the surface of every connecting hole 12 is machined so as to form a shape which is angular and whose surface area is increased. Then, a tube which guides a refrigerant to a condensation part is attached to the upper-side recessed part 11, a liquid return tube which guides the refrigerant returning from the condensation tube is attached, and the cooling body 10 is sealed. As a result, a structure which saves time and labor required for machining is formed, a structure in which fine air bubbles are generated in large quantities when the refrigerant is boiled is formed, and a superior cooling effect can be obtained.

JP4589239

Cooling structure of electronic equipment

Kazuhiro Yano
Higashiizumi
Ryoji Inoue

JP12823699A

December 13, 2006

May 10, 1999

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Fuji Electric Systems Co., Ltd.

H01L23/40; H01L23/427; (IPC1-7): H01L23/40; H01L23/427

JP6037219A
JP56115549A
JP58037482A

Hiroshi Yamamoto

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