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Patent Searching and Data


Title:
PREWIRED INJECTION MOLDING ASSEMBLY
Document Type and Number:
Japanese Patent JPH04226725
Kind Code:
A
Abstract:

PURPOSE: To provide a prewired injection molding assembly in which a long time is not required for wiring the lead wires from the nozzle of an injection molding machine.

CONSTITUTION: The prewired injection molding assembly 47 to be supplied to a customer for installation in a mold comprises a number of sub-manifolds 26 connected to a main manifold 22, a wiring frame 76 having a number of elongated fingers 78 connected to the sub-manifold 26, and a number of nozzles 10 connected to the sub-manifold 26. The fingers 78 of the wiring frame 76 extends from a hollow channel member 80 which leads to a connector box 84. The assembly is prewired by the supplier by running the wires from the nozzles 10 along the fingers 78 and through the channel member 80 to the connector box 84. The prewiring assembly 74 is mounted from the rear in a matching mold manifold plate 14 which greatly facilitates installation and disassembly for the customer.


Inventors:
JIYOBUSUTO ARURITSUCHI JIERAAT
SUTEIIBUN KEE FUOTSUKUSU
Application Number:
JP20646591A
Publication Date:
August 17, 1992
Filing Date:
July 23, 1991
Export Citation:
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Assignee:
MOLD MASTERS LTD
International Classes:
B29C45/22; B29C45/26; B29C45/27; B29C45/17; (IPC1-7): B29C45/17; B29C45/22
Attorney, Agent or Firm:
Kazuo Sato (3 others)