PURPOSE: A primer for a polyamide, improving adhesion between a metal and the polyamide, prepared by dissolving a phenoxy resin in an organic solvent.
CONSTITUTION: A phenoxy resin is dissolved in an organic solvent, to prepare a primer for a polyamide. A polymer, obtained by the polycondensation of bisphenol A and epichlorohydrin, followed by the reaction of the both terminal epoxy groups with a monohydric phenol, a mineral acid, a monocarboxylic acid, etc., is advantageously used as said phenoxy resin. Number-average MW of the phenoxy resin is preferably 5,000W300,000. The organic solvent is a hydrocarbon, alcohol, ether, ketone, ester, furmamide, etc. It is preferable to use the organic solvent in such proportions that the primer contains about 10W40wt% of the phenoxy resin.
ISHIDA HIDEO
TSURUSAWA KIYOSHI
