Title:
PRINTED CIRCUIT BOARD GRINDING APPARATUS
Document Type and Number:
Japanese Patent JP2001138202
Kind Code:
A
Abstract:
To provide a grinding apparatus of a printed circuit board to flatten a required area thereof with high accuracy.
In the grinding apparatus comprising an abrasive sheet with abrasive grains fixed to a surface thereof and a back-up mechanism which is abutted on a reverse side of the abrasive sheet to press the abrasive sheet against a surface of the printed circuit board, the back-up mechanism comprises a plurality of pressing members which are pressed against the abrasive sheet and flattened in their abutted surface, a base part to support the pressing members in an advancing/retractable manner, and an pressing means to independently press each pressing member in the direction of the sheet.
Inventors:
OGAWA HIROYOSHI
Application Number:
JP32275099A
Publication Date:
May 22, 2001
Filing Date:
November 12, 1999
Export Citation:
Assignee:
NODA SCREEN KK
International Classes:
B24B21/00; B24B21/06; H05K3/00; (IPC1-7): B24B21/00; H05K3/00
Domestic Patent References:
| JPH09298352A | 1997-11-18 | |||
| JPH03111165A | 1991-05-10 |
Attorney, Agent or Firm:
Kazuo Gero (1 person outside)