プリント回路基板及びその製造方法

Japanese Patent JP2013512581

A

A structure of a printed circuit board and a method of manufacturing the same are provided. The manufacturing method includes a first step of forming at least one connecting bump on first circuit patterns and forming a first insulating layer to form an inner circuit board, a second step of processing a second insulating layer with a metal seed layer formed thereon using a mold to form second circuit patterns so as to construct an outer circuit board, and a third step of aligning the inner circuit board and the outer circuit board with each other and laminating the inner circuit board and the outer circuit board. Accordingly, a structure of a high-density high-reliability printed circuit board having a circuit embedded in an insulating layer can be provided. A seed layer forming process for forming an outmost circuit can be removed by using an insulating layer combined with a seed layer. In addition, a conductive structure in the form of a connecting bump is formed, and thus a complicated process of forming a via-hole and filling the via-hole with a conductive material is not required. Furthermore, a process of grinding the surface of the filled conductive material is removed so as to remarkably decrease a circuit error rate.

Kim Jin Soo
Kim Duk Nam
Ange Hyun
Risan Mun
So Young Woo
Anti
Yoon Seung Eun
Nammyung Hwa

JP2012541940A

April 11, 2013

November 26, 2010

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LG Innotek Co., Ltd

H05K1/11; H05K3/40

JPH11307937A	1999-11-05
JP2003204140A	2003-07-18
JP2000323838A	2000-11-24
JP2006339365A	2006-12-14
JP2004152779A	2004-05-27

Atsushi Aoki
Jun Tsuruta
Tomohiro Minamiyama
Akira Kawai
Kenichi Nakamura

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