Title:
プリント回路板の製造方法、プリント回路板、及び電子機器
Document Type and Number:
Japanese Patent JP7362286
Kind Code:
B2
Abstract:
To improve reliability of junction in a joint part.SOLUTION: A printed wiring board 200 is provided with a member 500 having a property of repelling uncured thermosetting resin 451, and a paste P held between a land 130 of an image sensor 100 and a land 230 of the printed wiring board 200 is heated. With this configuration, solder powder contained in the paste P melts to be divided into molten solder 401 and the thermosetting resin 451. The flow of the thermosetting resin 451 is blocked due to repelling by the member 500. The thermosetting resin 451 is cured in the state of covering a joint part 400 with heating.SELECTED DRAWING: Figure 5
Inventors:
Mitsutoshi Hasegawa
Kunihiko Minegishi
Takashi Sakaki
Shingo Ishiguri
Kunihiko Minegishi
Takashi Sakaki
Shingo Ishiguri
Application Number:
JP2019069932A
Publication Date:
October 17, 2023
Filing Date:
April 01, 2019
Export Citation:
Assignee:
Canon Inc
International Classes:
H05K3/34; H01L21/60; H01L23/12; H05K3/00
Domestic Patent References:
| JP2010045463A | ||||
| JP2018056234A | ||||
| JP2018014674A |
Attorney, Agent or Firm:
Patent Attorney Corporation Chikajima International Patent Office