Title:
PRINTED-CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2785846
Kind Code:
B2
Abstract:
PURPOSE: To easily mount an electronic component by providing a wiring pattern and the electronic component which are connected via a bump electrode composed of a conductive paste.
CONSTITUTION: In a wiring board 20, a conductive paste is printed by a screen printing operation, the paste is hardened thermally, and bumps 25 are formed on a wiring pattern 4. In succession, the bumps 25 are overcoated with a conductive thermosetting adhesive 26. In succession, a semiconductor chip 8 is pressed to the wiring board 20 in such a way that electrodes 9 come into direct contact with the bumps 25. In addition, a heating treatment is executed to the wiring board 20 in this state, and the thermosetting adhesive 26 is hardened thermally. In this manner, the bumps 25 can be formed, and the semiconductor chip 8 can be mounted simply and surely.
Inventors:
HORI TAKESHI
Application Number:
JP10901495A
Publication Date:
August 13, 1998
Filing Date:
April 10, 1995
Export Citation:
Assignee:
SONII KK
International Classes:
B42D25/305; G06K19/07; G06K19/077; H01L21/60; H05K1/18; H05K3/24; H05K3/32; (IPC1-7): H05K1/18; B42D15/10; G06K19/077; H01L21/60; H05K3/24
Domestic Patent References:
| JP5799750A | ||||
| JP594196A |
Attorney, Agent or Firm:
Kei Tanabe