Title:
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2008166425
Kind Code:
A
Abstract:
To obtain a printed wiring board with which bonding strength of a bump and a pad is improved.
The printed wiring board 15 has a plurality of pads 35 to which bumps 25 are bonded. The pads 35 are independent of each other and are formed of a plurality of corresponding conductors 32a and 32b with respect to a single bump 25. A clearance g1, into which a portion of the bump 25 enters when the bump 25 is bonded to the pad 35, is provided between the plurality of conductors 32a and 32b.
Inventors:
KARASAWA JUN
HIRAMOTO SHUJI
HIRAMOTO SHUJI
Application Number:
JP2006353038A
Publication Date:
July 17, 2008
Filing Date:
December 27, 2006
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H05K3/34; H01L21/60; H05K1/02
Attorney, Agent or Firm:
Takehiko Suzue
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto
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