Title:
RIGID/FLEXIBLE PRINTED WIRING BOARD AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JP3241504
Kind Code:
B2
Abstract:
PURPOSE: To flatten the surface of a laminate after unified molding, by using prepreg for molding a rigid substrate and a flexible substrate in an unified body, as a spacer wherein a part corresponding with a flexible part is punched, and the prepreg corresponding with the punched flexible part is cured.
CONSTITUTION: This printed wiring board consists of a rigid part and a flexible part. A flexible substarate 1 and a rigid substrate 4 are subjected to unified molding and outer layer processing while prepreg 3 and a spacer are interposed, thereby obtaining the rigid part. As to the prepreg 3 for bonding the rigid substrate 4 and the flexible substrate 1, a part corresponding with the flexible part is previously punched, and the punched prepreg 3 corresponding with the flexible part is cured. The prepreg 3 is used as the spacer corresponding with the flexible part at the time of molding the rigid substrate 4 and the flexible substrate 1. Thereby a rigid flex printed wiring board wherein the manufacturing cost is low and the outer layer surface after lamination is flat.
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Inventors:
Heijiro Yanagi
Masahiro Tamura
Masahiro Tamura
Application Number:
JP21336793A
Publication Date:
December 25, 2001
Filing Date:
August 04, 1993
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
International Classes:
H05K1/02; H05K3/46; H05K3/00; (IPC1-7): H05K1/02; H05K3/46
Domestic Patent References:
| JP513958A | ||||
| JP355892A | ||||
| JP5696891A | ||||
| JP2229492A | ||||
| JP3141694A |
Attorney, Agent or Firm:
Nobuaki Sakaguchi