Title:
PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP3881286
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a material for manufacturing an electronic element such as a highly reliable printed capacitor and a printed varistor on a substrate with a high yield, and to provide a manufacturing method of the material and the substrate.
SOLUTION: Ferroelectric powder or varistor powder is printed on a printed wiring board in paste to compose a thick film, thus enabling the substrate itself to function as an electronic element. What is equivalent to a binder resin for composing the paste is used as a substrate material for making equal heat shrinkage, thus suppressing influence to dielectric characteristics due to heat generated in a subsequent process, varistor characteristics, and conductive characteristics. Further, a formed circuit surface is covered with the same kind of the binder resin to reduce the influence due to heat.
Inventors:
Kondo Masataka
Tadao Endo
Masayuki Yamazaki
Yoichi Koike
Shigeaki Sato
Atsushi Sugihara
Osamu Endo
Hiroshi Nakamura
Tadao Endo
Masayuki Yamazaki
Yoichi Koike
Shigeaki Sato
Atsushi Sugihara
Osamu Endo
Hiroshi Nakamura
Application Number:
JP2002158839A
Publication Date:
February 14, 2007
Filing Date:
May 31, 2002
Export Citation:
Assignee:
Yokohama Resistor Co., Ltd.
International Classes:
H05K1/16; H05K3/12; (IPC1-7): H05K1/16; H05K3/12
Domestic Patent References:
| JP9097737A | ||||
| JP2000235933A | ||||
| JP9017689A | ||||
| JP2001023869A |
Attorney, Agent or Firm:
Naoki Kubota