Title:
PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2016072306
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a printed wiring board capable of enhancing the heat resistance of a substrate by enhancing the adhesion strength of a conductive wire and a resin, while preventing occurrence of delamination between the conductive wire and the resin due to heat.SOLUTION: In a printed wiring board including a core substrate 4 where a wiring pattern 3 is formed on at least one surface of an insulating plate 2, an insulating resin layer 12 laminated on the surface of the core substrate 4, a wiring conductor layer 13 formed on the surface of the insulating resin layer 12, and a conductive wire 6 arranged in the insulating resin layer 12, and bonded to the wiring conductor layer 13, the conductive wire 6 is subjected to surface treatment for enhancing adhesion to the insulating resin layer 12.SELECTED DRAWING: Figure 1
Inventors:
WATANABE HIROMI
KATO KATSUMUNE
UEHARA TOSHIHISA
KATO KATSUMUNE
UEHARA TOSHIHISA
Application Number:
JP2014197419A
Publication Date:
May 09, 2016
Filing Date:
September 26, 2014
Export Citation:
Assignee:
KYOCERA CIRCUIT SOLUTIONS INC
International Classes:
H05K3/46; H05K3/38
Attorney, Agent or Firm:
Toshikazu Fukai