Title:
プリント配線板及、プリント回路板及び電子装置
Document Type and Number:
Japanese Patent JP7007057
Kind Code:
B2
Abstract:
To provide "a printed wiring board, a printed circuit board and an electronic device" that have EMC performance improved while maintaining stability in potential over the entire ground pattern.SOLUTION: In a first layer where an electronic component 12 is mounted, a power supply pattern 32 and a signal wiring pattern 33 are formed (a) surrounding a ground pattern 31. Further, the first layer has slits 34, as thin and long insulation regions provided by making the pattern absent, formed mutually at intervals for respective screwing holes 14 provided in the ground pattern 31 provided at a circumferential edge part. The slits 34 provided for the respective holes 14 are so provided as to eliminate linear conductive paths from the holes 14 to an electronic component 12 as much as possible. Further, the ground pattern 31 connecting the ground pattern 31 at the circumferential edge part and the ground pattern 31 in an internal region 15 to each other is present between the respective slits 34.SELECTED DRAWING: Figure 2
Inventors:
Kengo Onuma
Application Number:
JP2018018898A
Publication Date:
January 24, 2022
Filing Date:
February 06, 2018
Export Citation:
Assignee:
Alpine Electronics Co., Ltd.
International Classes:
H05K9/00; H05K1/02
Domestic Patent References:
| JP9008417A | ||||
| JP9129319A | ||||
| JP5219729A |
Attorney, Agent or Firm:
Katsushi Sato
Masahiko Amagai
Kazuyuki Tachibana
Kyozo Katayose
Masahiko Amagai
Kazuyuki Tachibana
Kyozo Katayose