Title:
PRINTED WIRING BOARD AND PRODUCTION THEREOF
Document Type and Number:
Japanese Patent JPH09186430
Kind Code:
A
Abstract:
To obtain a printed wiring board in which connection with an electronic device can be carried out well even when the wiring circuit pattern is formed with fine pitch by preventing the forming position of land from being shifted.
An outermost wiring circuit pattern 3 is provided, at a specified position thereof, with a resist layer 5 having an opening 4a of specified shape for partially exposing the wiring circuit pattern 3 and the opening 4a is plated, on the inside thereof, with a conductive material to form a land 6a. The wiring circuit pattern 3 is preferably formed by additive method. The resist layer 5 is preferably formed by exposing and developing a photoresist.
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Inventors:
KUZE YASUO
NAKAMURA EMI
ITO SHIGEYASU
NAKAMURA EMI
ITO SHIGEYASU
Application Number:
JP34415795A
Publication Date:
July 15, 1997
Filing Date:
December 28, 1995
Export Citation:
Assignee:
SONY CORP
International Classes:
H05K3/34; H05K3/18; H05K3/46; H05K3/24; H05K3/40; (IPC1-7): H05K3/18; H05K3/34
Attorney, Agent or Firm:
Akira Koike (2 outside)
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