Title:
PRINTED WIRING BOARD WITH INJECTION MOLDED BOARD
Document Type and Number:
Japanese Patent JPH02143487
Kind Code:
A
Abstract:
PURPOSE: To easily perform solder block lacquering by constituting the width of a narrow groove-shaped recessed part, so that an applied metal cover can reach the surface of a board and forming the width of a plane-shaped recessed part wide such that a fixed gap can remain between the metal cover inside this recessed part and the surface of the board. CONSTITUTION: When producing a printed wiring board, it is started from a board 1 provided with a groove-shaped recessed part 30 almost V-shaped, corresponding to a conductor pattern conduction image as an injection molding section, plane-shaped recessed part 40, a and through-hole 60 protruding from that recessed part. Next, after a surface 10 of the board 1 is treated ordinarily, a lacquer layer 4 is applied as an ordinary plating regist. Then, the lacquer layer is applied by roller coating but in that case, the recessed parts 30 and 40 are separated for a gap A. In this case, a growth seed 5 is applied and activated later, and continued by having the range not protected with the lacquer layer 4 coated with a metal layer 2 by the method of chemical deposition in the state of no current. Thus, the time for covering the metal 2 is suitably determined and the recessed part 30 is made sufficiently thick for completely reaching the surface of the board. Afterwards, a solder block lacquer 6 is applied by roller coating.
Inventors:
MARUSERU HEERUMAN
Application Number:
JP25692089A
Publication Date:
June 01, 1990
Filing Date:
September 28, 1989
Export Citation:
Assignee:
SIEMENS AG
International Classes:
H05K1/09; H05K1/11; H05K3/10; H05K3/18; H05K1/02; H05K3/42; H05K3/34; (IPC1-7): H05K1/02; H05K1/09; H05K3/18
Attorney, Agent or Firm:
Tomimura Kiyoshi