Title:
プリント配線板
Document Type and Number:
Japanese Patent JP5406907
Kind Code:
B2
Abstract:
Provided is a printed wiring board capable of inhibiting a reinforcing plate from peeling off even when a bending radius is small. The printed wiring board includes a wiring board main body, and a reinforcing plate attached to the wiring board main body, the reinforcing plate includes first and second reinforcing portions which are arranged to be mutually spaced apart, and a connecting portion which integrally connects the first reinforcing portion with the second reinforcing portion, and the connecting portion includes a first portion which has a cross-sectional area smaller than a cross-sectional area of the first reinforcing portion and smaller than a cross-sectional area of the second reinforcing portion, and a second portion of which a cross-sectional area increases along a direction from the first portion to at least one of the first reinforcing portion and the second reinforcing portion.
Inventors:
Hiroto Watanabe
Akiko Kametani
Akiko Kametani
Application Number:
JP2011258921A
Publication Date:
February 05, 2014
Filing Date:
November 28, 2011
Export Citation:
Assignee:
Fujikura Ltd.
International Classes:
H05K1/02
Domestic Patent References:
| JP4092669U | ||||
| JP63108660U | ||||
| JP2009111040A | ||||
| JP1157588A | ||||
| JP2005243968A | ||||
| JP2007165490A |
Attorney, Agent or Firm:
Eternal patent business corporation