PRINTED WIRING BOARD - FUJITSU LTD

Title:

PRINTED WIRING BOARD

Document Type and Number:

Japanese Patent JPH05198607

Kind Code:

A

Abstract:

PURPOSE: To prevent patting sealing resin from spreading over the wide range at low cost for a printed wiring board with a surface mounted semiconductor chip sealed by the potted synthetic resin.

CONSTITUTION: A printed wiring board with a surface mounted semiconductor chip 10 sealed by potted synthetic resin is provided with a solder resist film 6 applied on the surface of the printed wiring board 1 to make the mounting area of a semiconductor chip 10 opened, a frame-shaped component mounting mark 30, screen printed on the edge of the opening of the solder resist film 6 to display the mounting position of the semiconductor chip 10, and a plurality of holes 20 made in the vicinity of the component mounting mark 30 on the inner side of the mark 30.

Inventors:

TAKABAYASHI HIROYUKI
MITAMURA FUMIO
TSUBONE KENICHIRO

Application Number:

JP792792A

Publication Date:

August 06, 1993

Filing Date:

January 20, 1992

Export Citation:

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Assignee:

FUJITSU LTD

International Classes:

H01L21/52; H01L21/56; H01L23/28; (IPC1-7): H01L21/52; H01L21/56; H01L23/28

Attorney, Agent or Firm:

Teiichi

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